Description
Ideal for grinding Quartz and Ceramic materials used in the manufacturing process of semiconductor wafers, the latest model of the Lynx XG600 realizes a high level of precision and stable performance, while minimizing the defect rate when grinding workpieces composed of pure metal with high thermal resistance properties.
Excellent Machining Capability
- Equipped with a high-output 14.1 Kw motor for improved rough cutting & finish cutting.
- Machining of quartz and ceramic materials optimized by adoption of grinding spindle with a maximum speed of 5000r/min.
- grinding diameter 600mm
- grinding length 100mm
High Precision Machining
- Completed the continuous cutting accuracy level at maximum displacement of 17-20μm (*Temperature during test: 24.8~26.6℃)
- Hole grinding capability by adopting C axis control function
Enhanced Durability and User Convenience
- Structure enables easier handling of sludge (quartz dust).
- Spacious inner work area enabled by enlarging the space for door opening.
- Improved access for easier tool change.
- Grinding spindle equipped with phased command and display features
