Ideal for grinding Quartz and Ceramic materials used in the manufacturing process of semiconductor wafers, the latest model of the Lynx XG600 realizes a high level of precision and stable performance, while minimizing the defect rate when grinding workpieces composed of pure metal with high thermal resistance properties.<\/p>\n

Excellent Machining Capability<\/u><\/p>\n

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• Equipped with a high-output 14.1 Kw motor for improved rough cutting & finish cutting.<\/li>\n
• Machining of quartz and ceramic materials optimized by adoption of grinding spindle with a maximum speed of 5000r\/min.<\/li>\n
• grinding diameter 600mm<\/li>\n
• grinding length 100mm<\/li>\n<\/ul>\n

  High Precision Machining<\/u><\/p>\n

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  • Completed the continuous cutting accuracy level at maximum displacement of 17-20\u03bcm (*Temperature during test: 24.8~26.6\u2103)<\/li>\n
  • Hole grinding capability by adopting C axis control function<\/li>\n<\/ul>\n

    Enhanced Durability and User Convenience<\/u><\/p>\n

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    • Structure enables easier handling of sludge (quartz dust).<\/li>\n
    • Spacious inner work area enabled by enlarging the space for door opening.<\/li>\n
    • Improved access for easier tool change.<\/li>\n
    • Grinding spindle equipped with phased command and display features<\/li>\n<\/ul>\n

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